Industry

MGP launches new line of biodegradable resins for packaging industry

MGP launches new line of biodegradable resins for packaging industry
MGP launches new line of biodegradable resins for packaging industry

MGP, a supplier of grain and other plant-based ingredient solutions in the US, introduces its new Terratek BD biodegradable composite resins at the Sustainable Packaging Forum. “The launching of Terratek BD represents another major step in MGP’s ongoing commitment to deliver commercially-viable product offerings that help reduces reliance on conventional petroleum-based plastics,” said Mike Parker, Bioplastics Product Development and Sales Manager. “It provides an ideal alternative for multiple applications wherein the manufacture of fully compostable products is highly desirable.”

Mr Parker emphasizes that Terratek BD’s “unique ability to serve as a cost effective solution for creating heat-tolerant, bio-based compostable products” compared to similar type resins. “We view this as a significant breakthrough in that it can open new doors for the development of end-user products that maintain their physical integrity under moderate to high heat conditions.” He said. Applications for Terratek BD include a variety of injection molded industrial and consumer products such as disposable packaging materials and containers. “Durable products can benefit from being compostable at the end of their lifespan.” Mr Parker added.

Terratek BD is produced from a proprietary blend of wheat and corn-based products, as well as other compostable materials. Natural components derived from renewable grain sources make up the majority of the resins’ content by weight. The smooth, white, pellet-size resins can be easily processed, shaped and colored to specific product designs and needs, introduces MGP. “In addition to the excellent heat tolerance displayed by these new resins, they possess outstanding mechanical qualities, including strength and a rare combination of rigidity and pliability.” Adds Mr Parker. Sustainable Packaging Forum is being held in Pittsburg, the US from September 11-13.

SOURCE : http://www.adsalecprj.com/Publicity/MarketNews/lang-eng/article-126923/Article.aspx

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